Micro Electro Mechanical Systems (MEMS) technology is at the center of a rapidly emerging industry combining many different engineering disciplines & physics: electrical, electronic, mechanical, optical, material, chemical, and fluidic engineering disciplines. As the smallest commercially produced "machines," MEMS devices are similar to traditional sensors and actuators although much, much smaller. e.g. Complete systems are typically a few millimeters across, with individual devices and features of the order of 1-100 micrometers across.
Example of a MEMS switch, courtesy FEM-ware GmbHRF device. The response time of an electrostatic actuated beam is simulated. Actuation voltage, mechanical contact and fluid damping effects are simultaneously accommodated using our reduced order modellig (ROM) technique.
Microsystem Analysis Features
ANSYS Multiphysics has an extremely broad physics capability directly applicable to many areas of microsystem design. Coupling between these physics enables accurate, real world simulation of devices such as electrostatic driven comb drives. i.e.
• Electro-thermal-structural effects are employed in thermal actuators.
• Fluid (CFD) capabilities are used to compute flow and free surface droplet formation useful in the design of ink-jet printer nozzles, and lab-on-chip applications.
The following diagram explains how ANSYS Multiphysics capabilities fits into your Microsystem/MEMS design process:
A sample of the features included in ANSYS Multiphysics are listed below:
• Large deformation structural nonlinearities.
• Full contact with friction and thermal contact.
• Linear & non linear materials.
• Buckling, creep.
• Material properties: Temperature dependent, isotropic, orthotropic, anisotropic.
• Loads/Boundary conditions: Tabular, polynomial and function of a function loads.
• Plasticity, viscoplasticity, phase change.
• Electrostatics & Magnetostatics.
• Low Frequency Electromagnetics.
• High Frequency Electromagnetics. (Full wave, frequency domain).
• Circuit coupling - voltage & current driven.
• Acoustic - Structural coupling.
• Electrostatic-structural coupling.
• Capacitance and electrostatic force extraction.
• Fluid-Structural capability to evaluate damping effects on device response time.
• Microfluidics: Newtonian & non Newtonian continuum flow
• Free Surface VOF with temperature dependent surface tension.
• Charged particle tracing in electrostatic and magnetostatic fields.
• Electro-thermal-structural coupling.
• Piezoelectric & Piezoresistive transducers: Direct coupled structural-electric physics. Full isotropic, orthotropic parameters.
• Advanced themrolelectirc effect such as Seebeck, Peltier & thermocouple.
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