Mems optical

We offer custom solutions to OEM manufacturers ranging from concept to full scale volume manufacturing. Our facilities include a class 100 clean room environment, lithography and thin film processing. Our high standard of quality control is ensured by a suite of metrological systems and the use of modern statistical methods which underpin all of our production processes. As an ISO 9001:2008 certified company, we ensure the highest level of quality at a consistent level..
Axetris standard capabilities
Photolithography
Photolithography of 1 µm for up to 8" wafers
Single or double sided alignment
Thick resist processing (SU8, others)
Spray coating on severe topographies
Wet Etching
Anisotropic Silicon etching
Glass etching
Metal etching

Axetris standard capabilities
Photolithography
Photolithography of 1 µm for up to 8" wafers
Single or double sided alignment
Thick resist processing (SU8, others)
Spray coating on severe topographies
Wet Etching
Anisotropic Silicon etching
Glass etching
Metal etching
Metallization
Sputtering up to 8" wafers
Dielectric coating deposition
Silicon oxides and nitrides by PECVD
Oxides or nitrides by reactive sputtering
Reactive Ion Etching
Fused Silica
Silicon
Silicon Nitride / Oxide
Photoresist
Metrology and characterization
Interferometric and tactile surface measurements
Film thickness measurement
Resistivity & resistance
Optical microscopy
Scanning electron microscopy (SEM)
Axetris special capabilities
Micro-optics
Refractive and diffractive for micro-optical elements
Thin membranes
Thin dielectric membranes for optics, sensors and life science applications
CMOS wafers post processing
CMOS post processing like back side openings, metallization, thin film deposition






ADAN CHAPARRO
CI:17501640
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