MEMS are Micro Electro Mechanical Systems that are typically fabricated using standard silicon microfabrication techniques and specialized micromachining processes. MEMS can include electrical and mechanical elements and their interactions.
At Kodak, a comprehensive research program includes MEMS design, process, characterization and packaging of MEMS devices. Of special interest are devices that are fabricated using micro machining processes; these processes can be integrated with traditional silicon microelectronic fabrication to produce fully functional, addressable micro machines.
• Physical chemistry and interfacial sciences with an emphasis on semiconductor and optical materials
• Device architecture and design
• Device physics and quantum optics for device optimization and characterization
• Finite element analysis and computer simulation for thermal, fluidic, optical and mechanical performance
• MEMS processing, packaging and characterization
EMS processing, based on traditional integrated circuit processes, includes thin film deposition, photolithography, and both dry and wet chemical etch processes. In addition, state-of-the-art MEMS processes such as deep reactive ion etching, thick film processing, lamination, sacrificial layer release and wafer bonding can be used to build complex structures. Wafer-to-wafer bonding can be used to build 3D structures as well as provide a mechanism for packaging of MEMS devices. Throughout the processing and packaging of these complex devices, special attention is paid to cleanliness, stresses, changes in material properties and reliability.
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