domingo, 25 de julio de 2010



MEMS are Micro Electro Mechanical Systems that are typically fabricated using standard silicon microfabrication techniques and specialized micromachining processes. MEMS can include electrical and mechanical elements and their interactions.
Also, fluidic and optical elements can be incorporated into MEMS devices. At Kodak, major focus is on research in fluidic and optical MEMS devices. Optical MEMS, also known as MOEMS, is a specialized discipline of MEMS that incorporates photonics to the multifunctional devices. Many MEMS devices can be built on one silicon substrate, each with structures that are typically microns in size. At these small dimensions, forces that are not important at large dimensions can have major influence on the performance of the devices.

At Kodak, a comprehensive research program includes MEMS design, process, characterization and packaging of MEMS devices. Of special interest are devices that are fabricated using micro machining processes; these processes can be integrated with traditional silicon microelectronic fabrication to produce fully functional, addressable micro machines.
Kodak scientists are inventing MEMS devices for both continuous and drop-on-demand ink jet printing. MOEMS explorations include grating light valve modulating devices and shutter structures. Leveraging MEMS processing both at the Kodak Research Laboratories and through strategic partnerships, Kodak scientists must explore, apply and integrate a multitude of scientific competencies including:

• Physical chemistry and interfacial sciences with an emphasis on semiconductor and optical materials
• Device architecture and design
• Device physics and quantum optics for device optimization and characterization
• Finite element analysis and computer simulation for thermal, fluidic, optical and mechanical performance
• MEMS processing, packaging and characterization

EMS processing, based on traditional integrated circuit processes, includes thin film deposition, photolithography, and both dry and wet chemical etch processes. In addition, state-of-the-art MEMS processes such as deep reactive ion etching, thick film processing, lamination, sacrificial layer release and wafer bonding can be used to build complex structures. Wafer-to-wafer bonding can be used to build 3D structures as well as provide a mechanism for packaging of MEMS devices. Throughout the processing and packaging of these complex devices, special attention is paid to cleanliness, stresses, changes in material properties and reliability.

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